Experimental Measurements of Thermal Performances of Carbon Nanomaterial with Vertical Structures in Hotspot Heat Dissipation
Paper in proceeding, 2019

The dramatic progresses in electronics technologies in recent years bring forwards higher requests for quick and valid heat dissipation. Thermal management has become a vital issue in the performance and lifetime reliability of electronic devices and products with high packaging density. Carbon nanomaterials have attracted great attention due to their distinctive structures and excellent properties. In this paper, two kinds of carbon nanomaterials with vertical structures, namely carbon nanowalls and vertically aligned carbon nanofibers, have been prepared and tested to evaluate their heat dissipation performance. Experimental measurements have been carried out to obtain the hotspot temperatures of a test chip with and without the carbon nanomaterials applied. Comparisons of temperature values of the chip at various power loadings show that the utilization of both the carbon nanowalls and the carbon nanofibers can effectively decrease the hotspot temperature. And the heat dissipation improvement is remarkable at a high power density.

Author

Y. Zhang

Shanghai University

Longwang Tan

Shanghai University

Hang Yin

Shanghai University

Guoqiang Zhang

Shanghai University

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems

Shanghai University

Proceedings of the IEEE Conference on Nanotechnology

19449399 (ISSN) 19449380 (eISSN)

Vol. 2019-July 370-373 8993871
9781728128917 (ISBN)

19th IEEE International Conference on Nanotechnology, NANO 2019
Macau, China,

Subject Categories

Energy Engineering

Other Materials Engineering

Composite Science and Engineering

DOI

10.1109/NANO46743.2019.8993871

More information

Latest update

12/8/2020