New Nano-Thermal Interface Material for Heat Removal in Electronics Packaging
Paper in proceeding, 2006
Author
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany
Subject Categories
Other Materials Engineering