New Nano-Thermal Interface Material for Heat Removal in Electronics Packaging
Paper in proceedings, 2006

Author

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany

Subject Categories

Other Materials Engineering

More information

Created

10/6/2017