An aging study of intermetallic compounds formation in Sn-0.4Co-0.7Cu
Paper in proceeding, 2007
Author
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering