Overview of Conductive Adhesive Joining and Bumping Technology for direct chip attach applications
Book chapter, 2001

Author

Helge Kristiansen

Johan Liu

Department of Microelectronics and Nanoscience

Area Array Interconnection Handbook

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

ISBN

0-7923-7919-5

More information

Latest update

12/13/2018