Aerosol Jet Printing of Graphene and Carbon Nanotube Patterns on Realistically Rugged Substrates
Journal article, 2021
Direct-write additive manufacturing of graphene and carbon nanotube (CNT) patterns by aerosol jet printing (AJP) is promising for the creation of thermal and electrical interconnects in (opto)electronics. In realistic application scenarios, this however often requires deposition of graphene and CNT patterns on rugged substrates such as, for example, roughly machined and surface oxidized metal block heat sinks. Most AJP of graphene/CNT patterns has thus far however concentrated on flat wafer-or foil type substrates. Here, we demonstrate AJP of graphene and single walled CNT (SWCNT) patterns on realistically rugged plasma electrolytic-oxidized (PEO) Al blocks, which are promising heat sink materials. We show that AJP on the rugged substrates offers line resolution of down to similar to 40 mu m width for single AJP passes, however, at the cost of noncomplete substrate coverage including noncovered mu m-sized pores in the PEO Al blocks. With multiple AJP passes, full coverage including coverage of the pores is, however, readily achieved. Comparing archetypical aqueous and organic graphene and SWCNT inks, we show that the choice of the ink system drastically influences the nanocarbon AJP parameter window, deposit microstructure including crystalline quality, compactness of deposit, and inter/intrapass layer adhesion for multiple passes. Simple electrical characterization indicates aqueous graphene inks as the most promising choice for AJP-deposited electrical interconnect applications. Our parameter space screening thereby forms a framework for rational process development for graphene and SWCNT AJP on application-relevant, rugged substrates.
Author
Reinhard Kaindl
Joanneum Research Forschungsgesellschaft mbH
Tushar Gupta
Vienna University of Technology
Alexander Bluemel
Joanneum Research Forschungsgesellschaft mbH
Songfeng Pei
Chinese Academy of Sciences
Peng-Xiang Hou
Chinese Academy of Sciences
Chang Liu
Chinese Academy of Sciences
Paul Patter
Joanneum Research Forschungsgesellschaft mbH
Karl Popovic
Joanneum Research Forschungsgesellschaft mbH
David Dergez
ZKW Elektronik GmbH
Kenan Elibol
University of Vienna
Erhard Schaffer
University of Vienna
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Dominik Eder
Vienna University of Technology
Dietmar Kieslinger
ZKW Elektronik GmbH
Wencai Ren
Chinese Academy of Sciences
Paul Hartmann
Joanneum Research Forschungsgesellschaft mbH
Wolfgang Waldhauser
Joanneum Research Forschungsgesellschaft mbH
Bernhard C. Bayer
University of Vienna
Vienna University of Technology
ACS Omega
24701343 (eISSN)
Vol. 6 50 34301-34313Subject Categories
Inorganic Chemistry
Manufacturing, Surface and Joining Technology
Materials Chemistry
DOI
10.1021/acsomega.1c03871
PubMed
34963916