Graphene enhanced immersion cooling for data centers

Research Project, 2023 – 2024

Purpose and goal
Thermal management for servers still uses air cooling with heat sinks attached to the electronics components. The heat sink design is different in immersion liquid, and the temperature difference between the microprocessor and the surrounding dielectric coolant is typically between 30 and 40K. The goal of the project is to develop a graphene-enhanced thermal management solution targeting an improved thermal nanostructured material as the thermal dissipating medium to transfer the heat from the microprocessors immersed in dielectric liquids for data center applications.

Expected results and effects
The material and technology developed in the project aims to result in cost efficient, energy saving and environmentally friendly products. These products can help to improve the performance and reliability of existing and future data center ICT products by providing performance which is 2 to 4 times higher than existing products in terms of thermal dissipation capacity.