Development of High Adhesion Nano-Thermal Interface Materials for Electronics Packaging Applications
Paper in proceeding, 2006
Author
Tomas Aronsson
Wen Xuan Wang
Michael Olugbenga Olorunyomi
Xiuzhen Lu
Dongkai Shangguan
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
8th IEEE International Conference on Electronic Materials and Packaging (EMAP)
196-199
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering