Development of High Adhesion Nano-Thermal Interface Materials for Electronics Packaging Applications
Paper in proceedings, 2006

Author

Tomas Aronsson

Wen Xuan Wang

Michael Olugbenga Olorunyomi

Xiuzhen Lu

Dongkai Shangguan

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

8th IEEE International Conference on Electronic Materials and Packaging (EMAP)

196-199

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017