The influence of sintering process on thermal properties of nano-silver paste
Paper in proceeding, 2018
Nano-silver paste with low sintering temperature and high operation temperature was introduced to the application of bonding materials for GaN and SiC devices. Thermal properties are critical issues for die attach materials due to the heat dissipation requirements of high power devices. The influence of sintering process parameters for nano-silver paste on the thermal properties was investigated. The thermal conductivity of sintered nano-silver paste increased with the increase of sintering temperature and sintering time because of the dense structure due to high temperature and long sintering time. To improve the thermal property, Ag coated micro-SiC particles were used as an alternative to partly replace pure nano-Ag particles. The results demonstrate that the SiC particles can reduce the voids and improve the density of the sintered silver structure. Moreover, the addition of SiC particles can also contribute to the increase of thermal diffusivity. As a result, the thermal conductivity of sintered silver paste with 1.5 wt.% Ag coated SiC particles was two times as compared to that without SiC particles with the same Ag concentration.
Thermal conductivity
SiC particles
Sintering temperature
sintering time
nano-silver paste
Author
Xiuzhen Lu
Shanghai University
Qianran Zhang
Shanghai University
Abdelhafid Zehri
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Wei Ke
Shanghai University
Shirong Huang
Shanghai University
Cheng Zhou
Aerospace Science and Technology Corporation
Weijuan Xia
Aerospace Science and Technology Corporation
Yanpei Wu
Aerospace Science and Technology Corporation
Lilei Ye
SHT Smart High-Tech
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Shanghai University
SHT Smart High-Tech
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
1157-1160
978-1-5386-6386-8 (ISBN)
Subject Categories
Ceramics
Materials Chemistry
Other Materials Engineering
DOI
10.1109/ICEPT.2018.8480545
ISBN
9781538663868