Effect of microstructural evolution in electrically conductive adhesives containing Ag micro-fillers
Paper in proceedings, 2012

Author

Masahiro Inoue

Hiroaki Muta

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Proceedings of the ICEP-IAAC Conference

676-680

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017