Numerical investigation on the thermal properties of the micro-cooler
Paper in proceeding, 2010
Author
Yangming Liu
Shanghai University
Y. Zhang
Shanghai University
S. Wang
Shanghai University
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010
Article number 5583917 634-638
978-142448142-2 (ISBN)
Subject Categories
Physical Sciences
DOI
10.1109/ICEPT.2010.5583917
ISBN
978-142448142-2