Development of High Temperature Stable Isotropic Conductive Adhesives
Paper in proceedings, 2008

Author

Zhikun Zhang

Sijia Jiang

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Masahiro Inoue

Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging

E3-04

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017