Development of High Temperature Stable Isotropic Conductive Adhesives
Paper in proceeding, 2008
Author
Zhikun Zhang
Sijia Jiang
Chalmers, Applied Physics, Electronics Material and Systems
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Masahiro Inoue
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging
E3-04
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering