High performance packaging technology for 5G and future mobile communication

Research Project, 2019 – 2020

Purpose and goal: The aim of this pre-study is to investigate and develop a new type of copper-graphene composite with outstanding thermal property, while retaining equivalent mechanical property as Cu. This kind of composite can be used as a metal core embedded in the PCB. The attention will be put on the technology development of graphene filled copper composite with well aligned microstructure. At the same time, the board-design will be optimized and innovative build up concepts will be applied. Expected results and effects: We would like to achieve graphene/copper composite layered structures with a thermal conductivity in the range of 800 to 1000 W/mK (more than 2 times higher than copper) leading to enlarged capacity for improvement in electronics system. All the approach on advanced thermal management solutions will be presented on the board level, and these solutions will not only decrease the thermal path leading from the high power component through the board to the heat sink, but also have an impact concerning the mechanical miniaturization of the entire system. Approach and implementation: This project is an eight-month pre-study. Chalmers will lead the work and do the material characterization. Ericsson will provide the specification and make new design. SHT will produce graphene-based material. RISE will perform non-destructive and reliability test. There are three interrelated work packages focusing on different aspects of the overall problem: specification and board design, material processing and characterization, PCB system preliminary evaluation, and result analysis.