Reliability of ACF in Flip-Chip with Various Bump Height
Paper in proceedings, 2000

Author

C M L Wu

Johan Liu

Department of Microelectronics and Nanoscience

N H Yeung

Proceedings of the 4th Adhesive joining and Coating Technology in Electronics Manufacturing

101-106

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017