A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic conductive adhesive joining technology
Paper in proceeding, 2004
Author
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Photonics
Liqiang Cao
Min Xie
Thong-Ngee Goh
Yong Tang
Proceedings of the Polytronik04
RT23-
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering