Adhesion study of copper layer deposited and liquid crystalline polymer for electronics packaging
Paper in proceeding, 2005
Author
Qi Zhang
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Lars Nyborg
Chalmers, Materials and Manufacturing Technology, Polymeric Materials and Composites
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05)
pp109-114
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering