Adhesion study of copper layer deposited and liquid crystalline polymer for electronics packaging
Paper in proceedings, 2005

Author

Qi Zhang

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Lars Nyborg

Chalmers, Materials and Manufacturing Technology, Polymeric Materials and Composites

Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05)

pp109-114

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017