Reliability of Conductive adhesives
Book chapter, 2005

Author

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Zhimin Mo

Lead-Free Solder Interconnect Reliability


0-87170-816-7 (ISBN)

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

ISBN

0-87170-816-7

More information

Latest update

12/13/2018

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