Thermal Conductivity in the Vertical Direction of Heat-Resistant Epoxy Based Conductive Adhesives with Multimodal Filler Size Distributions
Conference contribution, 2010

Author

Masahiro Inoue

H Muta

S Yamanaka

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

IEEE CPMT Electronics System Integration Conference (ESTC)

Subject Categories

Other Materials Engineering

Areas of Advance

Materials Science

More information

Created

10/7/2017