Design and Development of Thin Film and LCP-Based System-on-Package Modules for RF/Wireless Applications
Paper in proceedings, 2003

Author

Z. Duo

L. Zheng

H. Tenhunen

L. Chen

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of The 4th Pori Electronics Production and Packaging Technology Conference

205-213

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017