Design and Development of Thin Film and LCP-Based System-on-Package Modules for RF/Wireless Applications
Paper in proceeding, 2003
Author
Z. Duo
L. Zheng
H. Tenhunen
L. Chen
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Proceedings of The 4th Pori Electronics Production and Packaging Technology Conference
205-213
Subject Categories (SSIF 2011)
Electrical Engineering, Electronic Engineering, Information Engineering