THERMAL MODELING FOR SYSTEM-IN-A-PACKAGE BASED ON EMBEDDED CHIP STRUCTURE
Paper in proceedings, 2005

Author

Liu Chen

Lisa Ekstrand

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of the 5th IEEE International Conferences on Adhesives and Polymers (POLYTRONIK05)

224-227

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017