Heating and reliability characterization electrically conductive adhesives using variable frequency microwave cure

Tiebing Wang; Ying Fu; Matthias Becker; Johan Liu

Heating and reliability characterization electrically conductive adhesives using variable frequency microwave cure
Paper in proceeding, 2000

Author

Tiebing Wang

Ying Fu

Matthias Becker

Johan Liu

Department of Microelectronics and Nanoscience

Other publications Research

3rd EPTC'2000

373-377

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017

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Heating and reliability characterization electrically conductive adhesives using variable frequency microwave cure Paper in proceeding, 2000