Preparation Techniques and Characterization for Sn-3.0Ag-0.5Cu Nanopowders
Paper in proceedings, 2007

Author

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)

Subject Categories

Materials Engineering

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017