Preparation Techniques and Characterization for Sn-3.0Ag-0.5Cu Nanopowders
Paper in proceeding, 2007
Author
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Subject Categories
Materials Engineering
Electrical Engineering, Electronic Engineering, Information Engineering