Microsystem Manufacturing, Assembly and Packaging Technology in Display-CardTM Applications
Paper in proceedings, 2004

Author

Junmei Duan

Johan Asplund

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4)

Vol. 04 EX905 pp 290-293

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

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Created

10/6/2017