Behaviour and Properties of Conductive Particles for Anisotropic Conductive Adhesive
Paper in proceeding, 2002
Author
Helge Kristiansen
Johan Liu
Department of Microelectronics and Nanoscience
The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP´02)
111-114
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering