Behaviour and Properties of Conductive Particles for Anisotropic Conductive Adhesive
Paper in proceedings, 2002

Author

Helge Kristiansen

Johan Liu

Department of Microelectronics and Nanoscience

The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP´02)

111-114

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017