Finite element analysis of bond line thickness and fiber distribution in solder based thermal interface materials
Paper in proceeding, 2017
thermal conductivity
thermal interface materials
BLT
stress
FE simulation
fibre distribution
Author
Maulik Satwara
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Josef Hansson
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
L. Ye
SHT Smart High-Tech
Henric Rhedin
SHT Smart High-Tech
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017
167-171
978-1-5386-3055-6 (ISBN)
Subject Categories
Polymer Technologies
DOI
10.1109/NORDPAC.2017.7993186
ISBN
978-1-5386-3055-6