Reliability Modeling and Simulation of Anisotropic Conductive Adhesive Flip-Chip Bonding Assembly using Global/Local FEM Approach
Paper in proceeding, 2004
Author
Zhimin Mo
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proc. of 6th Internal Conference on Electronic Materials & Packaging (EMAP 2004)
Vol. December pp 66-71
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering