Reliability Modeling and Simulation of Anisotropic Conductive Adhesive Flip-Chip Bonding Assembly using Global/Local FEM Approach
Paper in proceedings, 2004

Author

Zhimin Mo

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proc. of 6th Internal Conference on Electronic Materials & Packaging (EMAP 2004)

Vol. December pp 66-71

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

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Created

10/7/2017