Microwave transmission, heating of electrically conductive adhesives
Paper in proceedings, 2000

Author

Ying Fu

Tiebing Wang

Johan Liu

Department of Microelectronics and Nanoscience

Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis

134-139

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017