Espen Doedens

Showing 11 publications

2020

Space Charge Accumulation at Material Interfaces in HVDC Cable Insulation Part II - Simulations of Charge Transport

Espen Doedens, E. Markus Jarvid, Raphaël Guffond et al
Energies. Vol. 13 (7), p. 1750-1774
Journal article
2020

Space Charge Accumulation at Material Interfaces in HVDC Cable Insulation Part I—Experimental Study and Charge Injection Hypothesis

Espen Doedens, E. Markus Jarvid, Raphaël Guffond et al
Energies. Vol. 13 (8), p. 2005-2021
Journal article
2020

Considerations on the impact of material mesostructure on charge injection at cable interfaces

Espen Doedens, E. Markus Jarvid
IEEE Electrical Insulation Magazine. Vol. 36 (5), p. 43-51
Journal article
2020

Roughness Enhanced Charge Injection and Field Dependent Conduction Mechanisms for Bipolar Charge Transport Models

Espen Doedens, E. Markus Jarvid, Yuriy Serdyuk
Proceedings of the 2020 IEEE 3rd International Conference on Dielectrics, ICD 2020, p. 413-417
Paper in proceeding
2019

Enhanced charge injection in rough HVDC extruded cable interfaces

Espen Doedens, E. Markus Jarvid, Christian Frohne et al
IEEE Transactions on Dielectrics and Electrical Insulation. Vol. 26 (6), p. 1911-1918
Journal article
2019

Local surface field- and charge distributions and their impact on breakdown voltage for HVDC cable insulation

Espen Doedens, Markus Jarvid, Yuriy Serdyuk et al
Other conference contribution
2017

Cable surface preparation: chemical, physical and electrical characterization and impact on breakdown voltage

Espen Doedens, E. Markus Jarvid, Stanislaw Gubanski et al
Other conference contribution
2016

Surface preparations on MV-sized cable ends for ramped DC breakdown studies

Espen Doedens, Nils-Bertil Frisk, E. Markus Jarvid et al
Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP, p. 360-362
Paper in proceeding
2012

Effects of Inclusions of Oxidized Particles in XLPE on Treeing Phenomena

Espen Doedens, Anette Johansson, Markus Jarvid et al
Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP, p. 597-600
Paper in proceeding

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