SmartBowtie: PCB/LTCC/Silicon Based UWB mm-Wave Smart Capped Bowtie Array Antenna for 5G Communication Systems
Research Project , 2017 – 2019

Demands on high data transfer rate over wireless systems increase every year. Smart millimeter-wave (mm-Wave) wireless systems are inevitable for high data rate communications such as in the excess of 10-Gbps data transfer capacity in 5G (the fifth generation) communication systems and other future smart systems. Among all types of antennas, only PCB/LTCC/silicon based array antennas can offer fully integrated smart and low-cost array antennas for mm-Wave systems. However, the nowadays state-of-the-art PCB/LTCC/silicon based mm-Wave array antennas have been limited by narrow/one-band performance. This application proposes a new patented UWB (ultra-wideband) PCB/LTCC/silicon based antenna - smart capped bowtie antenna array based on the results of the feasibility study projects 2016-03935 to cover several planned 5G mm-Wave bands: 20-52 GHz, the V-band (57-66 GHz), E- band (71-86 GHz), W-band (92-115 GHz) and D-band (130-175 GHz). A few unique features will be enabled by this technology: Smart mm-Wave multi-steerable-beam MIMO array with UWB frequency coverage, low loss with high efficiency, and low cost with PCB/LTCC/silicon-based manufacturing. Project's final goal is to have the full development of the new UWB mm-Wave capped Bowtie array antenna technology, including design, simulation, optimization, manufacturing, and verification measurement and characterization. Several prototypes of smart capBowtie arrays will be made and measured for different applications, and several new patents are expected. The project results will provide a firm foundation, with antenna prototypes, for further integration, industrialization and commercialization of this technology into the 5G mm-Wave systems and other smart systems.

 

Participants

Jian Yang (contact)

Biträdande professor vid Chalmers, Electrical Engineering, Kommunikationssystem, informationsteori och antenner, Antennas

Zhongxia Simon He

Forskarassistent vid Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Ashraf Uz Zaman

Forskarassistent vid Chalmers, Electrical Engineering, Kommunikationssystem, informationsteori och antenner, Antennas

Vessen Vassilev

Forskare vid Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Collaborations

Ericsson, Göteborg

Göteborg, Sweden

Gapwaves AB

Västra Frölunda, Sweden

Leax Arkivator Telecom AB

Gothenburg, Sweden

Sony Mobile Communications AB

Lund, Sweden

Funding

VINNOVA

Funding Chalmers participation during 2017–2019

Related Areas of Advance and Infrastructure

Information and Communication Technology

Areas of Advance

More information

Latest update

2017-09-07