Flip chip assembly of a commersial MMIC amplifier on thin film alumina with electroplated pillars
Conference contribution, 2005

Author

Camilla Kärnfelt

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Christina Tegnander

Piotr Starski

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Janusz Rudnicki

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Anders Emrich

Proceedings of GigaHertz 2005

Vol. 1 1 234-237

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017