Camilla Kärnfelt
Showing 32 publications
A D-Band Packaged Antenna on Organic Substrate With High Fault Tolerance for Mass Production
A QFN packaged grid array antenna in low dielectric constant LTCC for D-band applications
Attempt of the Metallic 3D Printing Technology for Millimeter-Wave Antenna Implementations
Flip-Chip-Based Multichip Module for Low Phase-Noise V -Band Frequency Generation
Single-Chip Frequency Multiplier Chains for Millimeter-Wave Signal Generation
A Broadband 60-to-120 GHz single-chip MMIC multiplier chain
Circuit technologies for 100 Gbps wired communications
A Single-Chip 53 GHz Radiometer Front-End MMIC for Geostationary Atmospheric Measurements
60 GHz Single-Chip Front-End MMICs and Systems for Multi-Gbps Wireless Communication
Newly developed chip sets for 60 GHz radio communication systems
60 GHz Broadband MS-to-CPW Hot-Via Flip Chip Interconnects
Flip-Chip Mounted 1:4 Demultiplexer IC in InP DHBT Technology
Integrated Front-ends for Millimeterwave Applications Using III-V Technologies
High Gain Active Microstrip Antenna for 60 GHz WPAN/WLAN Applications
Investigation of Parylene-C on the performance of millimeter-wave circuits
High Purity 60 GHz-Band Single Chip
Single-Chip 60 GHz Transmitter and Receiver MMICs in a GaAs mHEMT Technology
Multifunctional MMIC design and antenna integration
Flip chip assembly of a commersial MMIC amplifier on thin film alumina with electroplated pillars
Highly Integrated 60 GHz Transmitter and Receiver MMICs in a GaAs pHEMT Technology
Integrated microstrip array antenna and amplifier at 60 GHz
V-band Single Chip Mutipliers.
A high purity 60 GHz single chip X8 multiplier with low phase noise
High Gain Active Microstrip Antenna for 60 GHz WLAN
Flip Chip Assembly of a 40-60 GHz GaAs Microstrip Amplifier
Simulations, measurements and equivalent circuit for a CPW-CPW vertical interconnection
GaAs Flip Chip Evaluation in the 3 to 110 GHz Range
GHz Flip Chip Interconnect Experiments
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