A D-Band Packaged Antenna on Organic Substrate With High Fault Tolerance for Mass Production
Journal article, 2016

A grid array antenna working around 145 GHz is proposed in this paper. The antenna is built on liquid crystal polymer (LCP) and designed for the D-band antenna-in-package application. The intrinsic softness of the LCP material is a limiting factor of the antenna's aperture size. A 0.5-mm-thick copper core is used to compensate. By doing this, the rigidness of the antenna is effectively improved, compared with an antenna without the copper core. Wet etching is used to realize the patterns on the top and bottom conductor. Compared with a low-temperature cofired ceramic counterpart, we obtain a considerable cost reduction with acceptable performance. The proposed antenna has an impedance bandwidth of 136-157 GHz, a maximum gain of 14.5 dBi at 146 GHz, and vertical beams in the broadside direction between 141 and 149 GHz. The fabrication procedures of the antennas are introduced, and a parametric study is carried out, which shows the antenna's robustness against fabrication tolerances, such as the not-well-controlled etching rate and the substrate surface roughness. This makes the antenna a promising solution for mass production.

liquid crystal polymer (LCP)

Antenna-in-package

grid array antenna

surface roughness

D-band

Author

Bing Zhang

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Camilla Kärnfelt

Institute Mines-Télécom

H. Gulan

Karlsruhe Institute of Technology (KIT)

T. Zwick

Karlsruhe Institute of Technology (KIT)

Herbert Zirath

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

IEEE Transactions on Components, Packaging and Manufacturing Technology

2156-3950 (ISSN)

Vol. 6 3 359-365

Subject Categories

Materials Engineering

DOI

10.1109/tcpmt.2016.2519522

More information

Latest update

4/9/2018 1