Low temperature full wafer adhesive bonding
Journal article, 2001

Author

Frank Niklaus

Peter Enoksson

Department of Microelectronics

Edvard Kälvesten

Göran Stemme

Journal of Micromechanics and Microengineering

Vol. 11 2 100-107

Areas of Advance

Nanoscience and Nanotechnology (2010-2017)

Production

Materials Science

Subject Categories

Other Engineering and Technologies

Chemical Engineering

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017