Low temperature full wafer adhesive bonding
Journal article, 2001
Author
Frank Niklaus
Peter Enoksson
Department of Microelectronics
Edvard Kälvesten
Göran Stemme
Journal of Micromechanics and Microengineering
Vol. 11 2 100-107
Areas of Advance
Nanoscience and Nanotechnology (SO 2010-2017, EI 2018-)
Production
Materials Science
Subject Categories
Other Engineering and Technologies
Chemical Engineering
Electrical Engineering, Electronic Engineering, Information Engineering