NOVEL METHOD FOR EVALUATING BOND STRENGTH OF VERY SMALL AREAS
Paper in proceeding, 2005

Author

Martin Bring

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Peter Enoksson

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of Micromechanics Europe 2005

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017