NOVEL METHOD FOR EVALUATING BOND STRENGTH OF VERY SMALL AREAS
Paper in proceeding, 2005
Author
Martin Bring
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Peter Enoksson
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of Micromechanics Europe 2005
Subject Categories
Other Electrical Engineering, Electronic Engineering, Information Engineering