Martin Bring

Showing 18 publications

2008

Novel monocrystalline silicon micromirrors for maskless lithography

Martin Bring, Peter Enoksson
Sensors and Actuators, A: Physical. Vol. 145-146 (1-1), p. 456-463
Journal article
2007

Submicron bond alignment accuracy using through-wafer holes

Martin Bring, Peter Enoksson
Proceedings of Micromechanics Europe Workshop, MME´07
Paper in proceeding
2007

Calibration methods of force sensors in the micro-Newton range

Alexandra Nafari, Farzan Alavian Ghavanini, Martin Bring et al
Journal of Micromechanics and Microengineering. Vol. 17 (10), p. 2102-7
Journal article
2007

Novel monocrystalline silicon micromirrors for maskless lithography

Martin Bring, Peter Enoksson
Preprint
2006

Method for measuring fracture toughness of wafer-bonded interfaces with high spatial resolution

Martin Bring, Peter Enoksson
Proceedings of Micro Structure Workshop 2006
Paper in proceeding
2006

Method for measuring fracture toughness of wafer-bonded interfaces with high spatial resolution

Martin Bring, Peter Enoksson, Anke Sanz-Velasco
Journal of Micromechanics and Microengineering. Vol. 16 (6), p. 68-74
Journal article
2006

Sensors and actuators based on SOI materials

Anke Sanz-Velasco, Alexandra Nafari, Henrik Rödjegård et al
Solid-State Electronics. Vol. 50, p. 865-876
Journal article
2006

Method for measuring fracture toughness of wafer-bonded interfaces with high spatial resolution

Martin Bring, Peter Enoksson, Anke Sanz-Velasco
proceeding of Eurosensors XX
Paper in proceeding
2005

NOVEL METHOD FOR EVALUATING BOND STRENGTH OF VERY SMALL AREAS

Martin Bring, Peter Enoksson
Proceedings of Micromechanics Europe 2005
Paper in proceeding
2005

Applications of SOI materials to quantum devices and Microsystems

Johan Piscator, Alexandra Nafari, Martin Bring et al
EUROSOI-2005
Paper in proceeding
2005

Wafer bonding for MEMS

Peter Enoksson, Cristina Rusu, Anke Sanz-Velasco et al
Proceeding of the 9th International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applic, Canadaations, Quebec City
Paper in proceeding
2004

A microdirect methanol fuel cell demonstrator

Konrad Wozniak, David Johansson, Martin Bring et al
Journal of Micromechanics and Microengineering. Vol. v14, p. S59-S63
Journal article
2003

A micro direct methanol fuel cell demonstrator

Konrad Wozniak, David Johansson, Martin Bring et al
Proceedings of the 14th Micromechanics Europe Workshop 2003, MME´03, Delft
Paper in proceeding
2003

MICRO PINBALL GAME DEMONSTRATING AN EASY MEMS TRANSFER PROCESS USING ROOM TEMPERATURE PLASMA BONDING

Martin Bring, Anke Sanz-Velasco, Peter Enoksson et al
Journal of Micromechanics and Microengineering. Vol. 13 (4), p. 51-56
Journal article
2002

Applications of plasma assisted wafer bonding

Petra Amirfeiz, Anke Sanz-Velasco, Martin Bring et al
Proceedings of the Workshop on wafer bonding, Barcelona, Spain
Paper in proceeding
2002

Micro pinball game demonstrating an easy MEMS transfer process using room temperature plasma bonding

Martin Bring, Anke Sanz-Velasco, Henrik Rödjegård et al
Proceedings of the 13th Micromechanics Europe workshop 2002, MME´02 Sinaia, Romania
Paper in proceeding

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