Design and fabrication of hidden hinge monocrystalline silicon micromirrors for maskless lithography
Doctoral thesis, 2008

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isotropic etching

LOCOS

micromirror

maskless lithography

chevron notch

low temperature transfer bonding

fracture toughness

Author

Martin Bring

Chalmers, Microtechnology and Nanoscience (MC2)

Included papers

MICRO PINBALL GAME DEMONSTRATING AN EASY MEMS TRANSFER PROCESS USING ROOM TEMPERATURE PLASMA BONDING

Journal of Micromechanics and Microengineering,;Vol. 13(2003)p. 51-56

Journal article

Method for measuring fracture toughness of wafer-bonded interfaces with high spatial resolution

Journal of Micromechanics and Microengineering,;Vol. 16(2006)p. 68-74

Journal article

Submicron bond alignment accuracy using through-wafer holes

Proceedings of Micromechanics Europe Workshop, MME´07,;(2007)

Paper in proceeding

Categorizing

Subject Categories (SSIF 2011)

Other Electrical Engineering, Electronic Engineering, Information Engineering

Identifiers

ISBN

978-91-7385-072-8

Other

Series

Technical report MC2 - Department of Microtechnology and Nanoscience, Chalmers University of Technology: 116

Doktorsavhandlingar vid Chalmers tekniska högskola. Ny serie: 2753

Public defence

2008-04-03 12:00

Kollektorn (A423), MC2-huset, kemivägen 9

Opponent: Dr. Peter Dürr, Fraunhofer Institute for Photonic Microsystems, Dresden, Germany.

More information

Created

10/6/2017