Design and fabrication of hidden hinge monocrystalline silicon micromirrors for maskless lithography
Doctoral thesis, 2008
isotropic etching
LOCOS
micromirror
maskless lithography
chevron notch
low temperature transfer bonding
fracture toughness
Author
Martin Bring
Chalmers, Microtechnology and Nanoscience (MC2)
MICRO PINBALL GAME DEMONSTRATING AN EASY MEMS TRANSFER PROCESS USING ROOM TEMPERATURE PLASMA BONDING
Journal of Micromechanics and Microengineering,;Vol. 13(2003)p. 51-56
Journal article
Method for measuring fracture toughness of wafer-bonded interfaces with high spatial resolution
Journal of Micromechanics and Microengineering,;Vol. 16(2006)p. 68-74
Journal article
Submicron bond alignment accuracy using through-wafer holes
Proceedings of Micromechanics Europe Workshop, MME´07,;(2007)
Paper in proceeding
Subject Categories
Other Electrical Engineering, Electronic Engineering, Information Engineering
ISBN
978-91-7385-072-8
Technical report MC2 - Department of Microtechnology and Nanoscience, Chalmers University of Technology: 116
Doktorsavhandlingar vid Chalmers tekniska högskola. Ny serie: 2753
Kollektorn (A423), MC2-huset, kemivägen 9
Opponent: Dr. Peter Dürr, Fraunhofer Institute for Photonic Microsystems, Dresden, Germany.