Wafer bonding for MEMS
Paper in proceeding, 2005
Author
Peter Enoksson
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Cristina Rusu
Anke Sanz-Velasco
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Martin Bring
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Alexandra Nafari
Chalmers, Microtechnology and Nanoscience (MC2)
Stefan Bengtsson
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceeding of the 9th International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applic, Canadaations, Quebec City
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering