Submicron bond alignment accuracy using through-wafer holes
Paper in proceedings, 2007

Author

Martin Bring

Chalmers, Microtechnology and Nanoscience (MC2)

Peter Enoksson

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of Micromechanics Europe Workshop, MME´07

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017