Submicron bond alignment accuracy using through-wafer holes

Martin Bring; Peter Enoksson

Submicron bond alignment accuracy using through-wafer holes
Paper in proceeding, 2007

Author

Martin Bring

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Peter Enoksson

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Proceedings of Micromechanics Europe Workshop, MME´07

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

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Created

10/6/2017

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Submicron bond alignment accuracy using through-wafer holes Paper in proceeding, 2007