Method for measuring fracture toughness of wafer-bonded interfaces with high spatial resolution
Paper in proceedings, 2006

Author

Martin Bring

Chalmers, Microtechnology and Nanoscience (MC2)

Peter Enoksson

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of Micro Structure Workshop 2006

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017