Method for measuring fracture toughness of wafer-bonded interfaces with high spatial resolution
Paper in proceeding, 2006

Author

Martin Bring

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Other publications Research

Peter Enoksson

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Other publications Research

Anke Sanz-Velasco

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Other publications Research

proceeding of Eurosensors XX


91-631-9280-2 (ISBN)

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

ISBN

91-631-9280-2

More information

Created

10/7/2017

Feedback and support

If you have questions, need help, find a bug or just want to give us feedback you may use this form, or contact us per e-mail research.lib@chalmers.se.

About

Research.chalmers.se contains research information from Chalmers University of Technology, Sweden. It includes information on projects, publications, research funders and collaborations.

More about coverage period and what is publicly available

Privacy and cookies

Accessibility

Citation Style Language
citeproc-js (Frank Bennett)

Links

Chalmers Library
Chalmers Research
Chalmers Student Theses

Chalmers University of Technology

SE-412 96 GOTHENBURG, SWEDEN
PHONE: +46 (0)31-772 10 00
WWW.CHALMERS.SE