Method for measuring fracture toughness of wafer-bonded interfaces with high spatial resolution
Paper in proceedings, 2006

Author

Martin Bring

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Peter Enoksson

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Anke Sanz-Velasco

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

proceeding of Eurosensors XX

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

ISBN

91-631-9280-2

More information

Created

10/7/2017