Low-temperature wafer-level transfer bonding
Journal article, 2001

Author

Niklaus Frank

Peter Enoksson

Department of Microelectronics

Patrick Griss

Edvard Kälvesten

Göran Stemme

Journal of Microelectromechanical Systems IEEE

Vol. 10 4 525 -531

Subject Categories

Mechanical Engineering

Materials Engineering

Other Engineering and Technologies

Electrical Engineering, Electronic Engineering, Information Engineering

Areas of Advance

Nanoscience and Nanotechnology (2010-2017)

Transport

Production

Materials Science

More information

Created

10/7/2017