A Method to Maintain Wafer Alignment Precision During Adhesive Wafer Bonding
Journal article, 2003

Author

Frank Niklaus

Peter Enoksson

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Edvard Kälvesten

Göran Stemme

Sensors and Actuators A: Physical

Vol. 107 3 273-278

Subject Categories

Mechanical Engineering

Materials Engineering

Other Engineering and Technologies

Electrical Engineering, Electronic Engineering, Information Engineering

Areas of Advance

Nanoscience and Nanotechnology (2010-2017)

Transport

Production

Materials Science

More information

Created

10/7/2017