A Method to Maintain Wafer Alignment Precision During Adhesive Wafer Bonding
Journal article, 2003
Author
Frank Niklaus
Peter Enoksson
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Edvard Kälvesten
Göran Stemme
Sensors and Actuators A: Physical
Vol. 107 3 273-278
Subject Categories
Mechanical Engineering
Materials Engineering
Other Engineering and Technologies
Electrical Engineering, Electronic Engineering, Information Engineering
Areas of Advance
Nanoscience and Nanotechnology (SO 2010-2017, EI 2018-)
Transport
Production
Materials Science