Void-Free Full Wafer Adhesive Bonding
Paper in proceedings, 2000

Author

Frank Niklaus

Peter Enoksson

Department of Microelectronics

Edvard Kälvesten

Göran Stemme

IEEE International Workshop on Micro Electromechanical Systems (MEMS2000), Miyazaki, Japan, Jan. 23-27

247-252

Subject Categories

Mechanical Engineering

Materials Engineering

Other Engineering and Technologies

Chemical Engineering

Electrical Engineering, Electronic Engineering, Information Engineering

Areas of Advance

Nanoscience and Nanotechnology (2010-2017)

Production

Materials Science

More information

Created

10/7/2017