Low temperature full wafer adhesive bonding of structured wafers
Paper in proceedings, 2000

Author

Frank Niklaus

Helene Andersson

Peter Enoksson

Department of Microelectronics

Göran Stemme

EUROSENSORS XIV, Copenhagen, Denmark, Aug. 27-30

Areas of Advance

Nanoscience and Nanotechnology (2010-2017)

Production

Materials Science

Subject Categories

Materials Engineering

Other Engineering and Technologies

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017