Analysis and Design of RF Power and Data Link Using Amplitude Modulation of Class-E for a Novel Bone Conduction Implant
Journal article, 2012

This paper presents analysis and design of a radio frequency power and data link for a novel Bone Conduction Implant (BCI) system. Patients with conductive and mixed hearing loss and single-sided deafness can be rehabilitated by bone-anchored hearing aids (BAHA). Whereas the conventional hearing aids transmit sound to the tympanic membrane via air conduction, the BAHA transmits sound via vibrations through the skull directly to the cochlea. It uses a titanium screw that penetrates the skin and needs life-long daily care; it may cause skin infection and redness. The BCI is developed as an alternative to the percutaneous BAHA since it leaves the skin intact. The BCI comprises an external audio processor with a transmitter coil and an implanted unit called the bridging bone conductor with a receiver coil. Using amplitude modulation of the Class-E power amplifier that drives the inductive link, the sound signal is transmitted to the implant through the intact skin. It was found that the BCI can generate enough output force level for candidate patients. Maximum power output of the BCI was designed to occur at 5-mm skin thickness and the variability was within 1.5 dB for 1–8-mm skin thickness variations.

bone anchored hearing aid (BAHA)

class-e power amplifier

bone conduction devices

low-power systems

implantable hearing devices

data link

radio frequency (RF) power

implantable transducer

bone conduction implant (BCI)

Amplitude modulation (AM)

Author

Hamidreza Taghavi

Chalmers, Signals and Systems, Signal Processing and Biomedical Engineering

Bo Håkansson

Chalmers, Signals and Systems, Signal Processing and Biomedical Engineering

Sabine Reinfeldt

Chalmers, Signals and Systems, Signal Processing and Biomedical Engineering

IEEE Transactions on Biomedical Engineering

0018-9294 (ISSN) 15582531 (eISSN)

Vol. 59 11 3050-3059 6269064

Subject Categories

Medical Engineering

Other Electrical Engineering, Electronic Engineering, Information Engineering

Areas of Advance

Life Science Engineering (2010-2018)

DOI

10.1109/TBME.2012.2213252

More information

Created

10/8/2017