Wafer bonding: A flexible way to manufacture SOI materials for high performance applications
Paper in proceedings, 2004

An overview is given on the use of wafer bonding for formation of Silicon-On-Insulator (SOI) materials for high performance applications. Recent developments in wafer bonding and available techniques for formation of thin semiconductor films is presented. Furthermore, a review is given on results in use of wafer bonding for formation of advanced SOI-materials. Finally, a more detailed discussion is given on the use of wafer bonding for manufacture of SOI-materials intended for high-frequency applications and SOI-materials with films of electrically insulating but highly thermally conductive materials as buried insulators.

Thin films

Strength of materials

Silicon on insulator technology

MOSFET devices

CMOS integrated circuits

Thermal conductivity

Silicon on sapphire technology

Silicon wafers

Author

Stefan Bengtsson

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Petra Amirfeiz

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Mikael Johansson

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proc. 19th Symp. on Microelectronics Technology and Devices

Vol. 3 241-

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017