The influence of surface microroughness on wafer bonding
Licentiate thesis, 1996
AFM
hydrophilic
surface roughness
diamond
silicon-on-insulator
poly silicon
silicon-on-diamons
atomic force microscope
wafer bonding
SOI
aluminum nitride
hydrophobic
Author
Mats Bergh
Department of Solid State Electronics
Subject Categories (SSIF 2011)
Other Electrical Engineering, Electronic Engineering, Information Engineering
ISBN
91-7197-438-5
Technical report L - School of Electrical and Computer Engineering, Chalmers University of Technology. : 257