The influence of surface microroughness on wafer bonding
Licentiatavhandling, 1996

AFM

hydrophilic

surface roughness

diamond

silicon-on-insulator

poly silicon

silicon-on-diamons

atomic force microscope

wafer bonding

SOI

aluminum nitride

hydrophobic

Författare

Mats Bergh

Institutionen för fasta tillståndets elektronik

Ämneskategorier

Annan elektroteknik och elektronik

ISBN

91-7197-438-5

Technical report L - School of Electrical and Computer Engineering, Chalmers University of Technology. : 257