Tunable Microwave Arrangements
Patent application, 2007

The present invention relates to a tunable microwave arrangement (10) comprising a microwave/integrated circuit device (11) and a substrate (6). It comprises a layered structure disposed between said microwave/integrated circuit device and said substrate (5), said layered structure acting as a ground plane and it comprises at least one regularly or irregularly patterned first metal layer (1), at least one second metal layer (3), at least one tunable ferroelectric film layer (2), whereby said layers are so arranged that the ferroelectric film layers) (2) is/are provided between the/a first metal layer (1) and the/a second metal layer (3).


Spartak Gevorgian

Chalmers, Microtechnology and Nanoscience (MC2), Microwave and Terahertz Technology

Lewin Thomas

Dan Kuylenstierna

Chalmers, Applied Physics, Physical Electronics

Telefonaktiebolaget L M Ericsson

US20070262830 A1

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

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