Solidification of alloy 718, ati 718Plus® and waspaloy
Paper in proceedings, 2014

Alloy 718, ATI 718Plus® and Waspaloy have been investigated in terms of what their respective solidification process reveals. Differential thermal analysis was used to approach the task together with secondary electron and back scattered electron detectors equipped with an energy dispersive X-ray spectroscopy detector. These experimental methods were used to construct pseudo binary phase diagrams that could aid in explaining solidification as well as liquation mechanisms in processes such as welding and casting. Furthermore, it was seen that Waspaloy has the smallest solidification range, followed by Alloy 718, and finally ATI 718Plus® possessing the largest solidification interval in comparison.

Differential thermal analysis

Superalloys

Solidification

Author

Joel Håkan Andersson

Chalmers, Materials and Manufacturing Technology, Surface and Microstructure Engineering

S. Raza

A. Eliasson

Kumar Babu Surreddi

Chalmers, Materials and Manufacturing Technology, Surface and Microstructure Engineering

8th International Symposium on Superalloy 718 and Derivatives 2014; Pittsburgh; United States; 28 September 2014 through 1 October 2014

181-192

Subject Categories

Materials Engineering

ISBN

978-163439642-4

More information

Created

10/7/2017