Analysis of Mechanical Strength for Flip-chip Bonding of GaAs MMIC
Paper in proceedings, 2006
Author
Bo Zhang
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Shanghai, China
Subject Categories
Other Materials Engineering