Analysis of Mechanical Strength for Flip-chip Bonding of GaAs MMIC
Paper in proceeding, 2006

Author

Bo Zhang

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Shanghai, China

Subject Categories (SSIF 2011)

Other Materials Engineering

More information

Created

10/6/2017